Technical Program
Plan today to attend ISTFA 2026
The comprehensive event offers attendees a dynamic experience with diverse learning opportunities. From engaging oral and poster presentations to interactive user groups and tutorials, participants can delve into intricate research findings and innovative ideas. Keynotes and panels provide overarching insights from industry experts, enriching collective knowledge. With such a multifaceted program, attendees are sure to leave inspired and equipped with valuable insights for future endeavors.
Topics for the 2026 conference include:
- AI Applications for Failure Analysis
- Emerging FA Techniques and Concepts
- Die Level Fault Isolation
- Package Level Fault Isolation
- Packaging and Assembly
- System in Package and 3D Devices
- Wide Bandgap Power Devices (SiC, GaN, new materials)
- Boards and Systems
- FIB Circuit Edit
- Sample Preparation and Device De-processing
- FIB Sample Preparation
- Microscopy Analysis and Material Characterization
- Case Studies: Device Analysis
- Case Studies: FA Process and Workflows
- Product Yield, Test and Diagnostics
- Trusted Electronics
