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Technical Program

Plan today to attend ISTFA 2027

Join us for the International Symposium for Testing and Failure Analysis (ISTFA) 2027, taking place October 31 – November 4, 2027, in Phoenix, Arizona.

ISTFA 2027 will bring together failure analysis professionals, researchers, engineers, and industry leaders from around the world for a dynamic experience focused on advancing the field of microelectronics failure analysis. Attendees can look forward to engaging technical presentations, poster sessions, educational tutorials, interactive discussions, and valuable networking opportunities.

Through expert-led sessions, innovative research, real-world case studies, and emerging technologies, ISTFA provides a collaborative environment for exchanging knowledge, exploring new techniques, and addressing the evolving challenges facing the failure analysis community.

Topics for ISTFA 2027 include:

  • AI Applications for Failure Analysis
  • Boards and Systems
  • Design for Analysis, Test, and Diagnostics
  • Device Analysis Case Studies
  • Die Level Fault Isolation
  • Emerging FA Techniques and Concepts
  • FA of Ultra-Efficient Device Technologies
  • FA Process and Workflows
  • FIB Sample Preparation and Circuit Edit
  • Microscopy Analysis and Material Characterization
  • Package Level Fault Isolation
  • Product Yield
  • Sample Preparation and Device De-processing
  • Silicon Photonics and Co-Packaged Optics
  • System in Package and 3D Devices
  • Trusted Electronics
  • Wide Bandgap Power Devices (SiC, GaN, new materials)

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