Hitachi High-Technologies Corp., Tokyo, announces that it has developed an advanced CD Measurement SEM (CD-SEM), the CG7300, which provides enhanced high-precision measurement and improved throughput performance.
The tool is based on a “common platform concept” that has been extended from the previous model, the CG6300. This latest model is geared toward mass production of 5nm-generation devices, and development of 3nm-generation devices for EUV Lithography.
Hitachi High-Tech launched its first CD-SEM in 1984, earning recognition for its high-precision measurement performance and high-quality images. Hitachi High-Tech’s CD-SEMs have become the defacto standard in the field of metrology, creating and leading a market for electron beam metrology, and shipping over 5000 units as of 2017.
The newly developed CG7300 offers enhanced performance of established conventional CD-SEM measurement techniques, including measurements of EPE, CD/Roughness, overlays, and low damage. The result is highly precise and accurate measurements of increasingly complex patterns for semiconductor mass production by the EUV Lithography process. Furthermore, the enhanced electron beam scanning control system and wafer transport system have been modified to increase wafer processing throughput by 20% compared to the previous model.
CG7300’s “tool to tool matching” concept prioritizes compatibility with the previous model (CG6300). Measurement results variation between CD-SEMs is further minimized, allowing for more flexibility of tool management in the existing mass production lines, and realizing the long-term stability and tools availability.
