Dow Electronic Materials, Marlborough, Mass., announces availability of its Solderon BP TS 6000 tin-silver plating chemistry for lead-free solder bump plating applications. In copper pillar capping applications, it forms a smooth, micro-void free interface post reflow. It features enhanced plating performance, bath stability, and ease of use, thereby enabling the industry’s widest process window with the most robust process flexibility and a competitive cost of ownership.
“As flip chip packages become mainstream and the industry continues to move toward 2.5D and 3D packaging technologies, there is a clear market requirement for high-performance lead-free alternatives for plating applications,” said Dr. Robert Kavanagh, global business director, Advanced Packaging Metallization, for Dow Electronic Materials. “Customers need materials optimized for today’s finer bump geometries. This new chemistry achieves significant performance improvements, delivering even faster plating speeds, better uniformity and smoother surface morphology in addition to a smooth, void-free interface when used together with Dow’s and other leading copper pillar formulations.”
With a single formulation, Solderon BP TS 6000 Tin-Silver (SnAg) is capable of plating speeds ranging from 2 to 9 µm/min., which creates a significantly wider operating window when compared with other solutions in the marketplace. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications and eliminates the need to change the chemistry to address different processing requirements.
