Electronics Archives - Page 29 of 39

Zeiss Versa X-ray microscope with FPX flat panel extension enables faster sample scanning

Carl Zeiss X-ray Microscopy Inc., Germany, introduces the Xradia Versa X-ray 500-series of 3D X-ray microscopes with FPX flat panel extension, which enhances imaging flexibility and creates workflow efficiencies.

Microchip Technology acquires Amtel to combine product portfolios

Microchip Technology Incorporated, Chandler, Ariz., and Atmel Corp., San Jose, Calif., announce that Microchip has signed a definitive agreement to acquire Atmel for $8.15 per share in a combination of cash and Microchip common stock.

Amkor Technology announces acquisition of remaining shares of J-Devices

Amkor Technology Inc., Tempe, Ariz., has increased its ownership interest in J-Devices Corp., Japan, from 65.7% to 100% through the exercise of previously disclosed options.

Lasertec laser microscope achieves high-resolution of wafer surfaces

Lasertec, Japan, offers the WASAVI series BIM300 laser microscope, which achieves high-resolution observation on wafer surfaces, as well as high precision measurement of via reveal and bump dimensions and shapes.

Library of nanoporous gold structures produced on single chip via tunable lasers

Lawrence Livermore National Laboratory. Livermore, Calif., reports that its researchers have created a library of nanoporous gold structures on a single chip that has direct applications for high-capacity lithium ion batteries as well as neural interfaces.

SEMI Awards honor process and technology integration achievements

SEMI, San Jose, Calif., announces the recipients of the 2015 SEMI Awards for innovations that have become such an integral part of the semiconductor manufacturing industry’s infrastructure that the technology itself has become fundamental.

Cadence and Arrow Electronics collaborate to develop integrated PCB design tools

Cadence Design Systems Inc., San Jose, Calif., and Arrow Electronics, Centennial, Colo., announce a collaboration that will bring integrated design tools to engineers, helping them accelerate the pace of new product development and get products to market faster and cheaper.

Orbotech to supply UV laser drilling systems for drilling vias in ceramic substrates

Orbotek Ltd., Israel, has received an order for seven Emerald UV laser drilling systems to drill smaller, high-quality “via” openings in multi-layer ceramic-based IC substrates for next-generation applications.

Cornell research team works to reduce GaN power diode defects and improve reliability

Cornell University, Ithaca, N.Y., the University of Notre Dame, South Bend, Ind., and the semiconductor company IQE, Cardiff, Wales, put together an engineering team that has created gallium nitride (GaN) power diodes capable of serving as building blocks for future GaN power switches.

Heraeus expands sources to strengthen supply chain for silver powders

Heraeus Photovoltaics, Germany, announces a new and comprehensive supply chain strategy to ensure AG silver powders for its product line.

Qualcomm and TDK to jointly develop RFFE modules and RF filters into integrated systems

Qualcomm Inc., San Diego, Calif., and TDK Corp., Japan, have agreed to form a joint venture under the name RF360 Holdings Singapore PTE. Ltd. develop RF front-end (RFFE) modules and RF filters into fully integrated systems.

Bruker introduces MultiMode 8-HR atomic force microscope for nanoscale research

Bruker Nano Surfaces, Santa Barbara, Calif., announces that it has significantly enhanced the capabilities of its MultiMode platform with the MultiMode 8-HR.

Tresa Pollock named Principal Editor for Metallurgical and Materials Transactions

ASM International, Materials Park, Ohio, announces that the new principal editor of the Metallurgical and Materials Transactions (Met Trans) family of journals will be Dr. Tresa M. Pollock, an internationally recognized leader in the science and technology of advanced structural alloys.

Consortium for the Advancement of Shape Memory Alloy Research and Technology

SMST recently teamed up with a small international organization of leading players in the SMA actuation field known as CASMART (Consortium for the Advancement of Shape Memory Alloy Research and Technology).

Smart supercapacitor fiber with shape memory

Fudan University, China, announces that a research team led by Prof. Huisheng Peng has developed stretchable, pliable supercapacitor fibers with shape memory.

Axial III Suspension Plasma Spray enables nanoparticles in thermal barrier coatings

Northwest Mettech, North Vancouver, British Columbia, has developed a NanoFeed line of liquid and suspension feeders to enable delivery of submicron powders to thermal spray torches.

Nitinol shape-memory alloy with added hafnium resists both wear and corrosion

Puris LLC, Bruceton Mills, W. Va., recently signed a limited (partially) exclusive, term license agreement with NASA Glenn Research Center to produce a high-performance, hafnium-enhanced shape-memory powder metallurgy alloy that provides resistance to both wear and corrosion.

Magnesium infused with SiC nanoparticles is strong and lightweight

University of California at Los Angeles researchers have reportedly designed a magnesium-matrix composite reinforced with a dense and even dispersal of silicon carbide nanoparticles.

High-strength magnesium-lithium alloy weighs half as much as aluminum

The University of New South Wales and Monash University, Australia, announce that a team of researchers has developed a high-strength magnesium-lithium alloy with density of 1.4 g/cm3, half as much as aluminum and 30% less than magnesium.

Imec, Coventor collaborate to optimize 7 nm semiconductor manufacturing

Imec, Belgium, and Coventor, Cary, N.C., announce the expansion of a joint development project to explore process variation issues in 7 nm semiconductor technology.

Cardiff University and IQE partner to build center for compound semiconductor research

Cardiff University and IQE plc, both of Wales, announce a joint venture to build the Compound Semiconductor Centre, which has the goal of developing and commercializing next-generation compound semiconductor technologies.

On Semiconductor to acquire Fairchild Semiconductor for $2.4 billion

On Semiconductor Corp., Phoenix, Ariz., and Fairchild Semiconductor Intl. Inc., South Portland, Maine, announce plans for On Semiconductor to acquire Fairchild for $20.00 per share in an all cash transaction valued at approximately $2.4 billion.

Copper oxide coated microporous foam heat sinks enable higher emissivity

Goodfellow Corp., Coraopolis, Pa., reports that its microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.

Helios G4 HX designed for high-throughput failure analysis of semiconductors

FEI Co., Hillsboro, Ore., introduces the Helios G4 HX as the industry’s highest throughput, dedicated TEM lamella preparation platform, designed to meet the challenges of advanced semiconductor failure analysis labs.

Bruker D8 Gen 2 crystallography platform optimized for X-ray diffraction

Bruker AXS, Madison, Wis., introduces the D8 Gen 2, which features the latest version of the Incoatec Microfocus Source, the IµS 3.0, the first microfocus source specifically designed and optimized for X-ray diffraction.

Mentor Graphics Veloce emulation platform supports Andes Processors

Mentor Graphics Corp., Wilsonville, Ore., announces that its Veloce emulation platform, specifically the Codelink offering, now supports the debug of designs built with AndesCore processors such as N10 and N13.

Lasertec wafer edge inspection enables higher chip production

Lasertec Corp., Japan, announces that it has launched its EZ300, a wafer edge inspection system based on a new concept that contributes to higher yields at wafer edges in the production of semiconductor chips.

Nanodiamond-containing polymers conduct heat, resist wear

Carbodeon, Finland, has been granted a U.S. patent for detonation-synthesized diamond particles (nanodiamonds) that are combined with polymers to produce wear-resistant materials with good thermal conductivity.

Acxys tool enables precise deposition of SiOx thin films in open air

Acxys Technologies, France, has introduced its UL-Coat (ULC) module, which injects a precursor into plasma generated by its ULS plasma spot module, thus enabling deposition of thin films of SiOx in open air.

Leco opens European tech center in Berlin

Leco Corp., St. Joseph, Mich., has established a new European Application and Technology Center in Berlin, with close to 25 Leco analytical instruments available for hands-on customer demonstrations and application work.

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