Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5% compared to the previous quarter.

Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company’s next-generation 14-nm FinFET process technology.

Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.

Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5% compared to the previous quarter.

Northwestern University, Evanston, Ill., reports that a new method of semiconductor characterization that is more accurate, efficient, and simple than existing methods has been developed by its researchers.

Ultratech Inc., San Jose, Calif., introduces the Superfast 4G+ in-line 3D topography wafer inspection system featuring coherent gradient sensing technology that enables a single wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost.

Edax Inc., Mahwah, N.J., introduces a new series of Octane Elite silicon drift detectors, which offer up to 35% better light-element sensitivity and outstanding low-energy performance due to silicon nitride entry windows.

Hitachi High Technologies America Inc., Clarksburg, Md., announces that Hitachi, the University of Colorado at Boulder, and the TEM camera manufacturer Advanced Microscopy Techniques (AMT) of Woburn, Mass., have collaborated to develop a convenient software package for state-of-the-art, single or dual-axis tomography acquisition and extended image montaging for the Hitachi HT7700 TEM.

Rudolph Technologies Inc., Flanders, N.J., has purchased Stella Alliance LLC for its patented illumination, auto-focus, and image acquisition technology, which significantly enhances the ability to identify certain critical defects not visible with current techniques.

DCG Systems, Fremont, Calif., has released the Meridian M system for isolation of both routine and challenging electrical faults at the wafer level.

Georgia Institute of Technology, Atlanta, reports that its researchers have developed a technology for cooling transistors that is based on de-ionized water flowing through microfluidic passages.