Researchers at Oak Ridge National Laboratory, Oak Ridge, Tenn., demonstrated that stainless steel and other metal alloys coated with hexagonal boron nitride, or hBN, exhibit non-stick or low-friction qualities along with improved long-term protection against harsh corrosion and high-temperature oxidation in air.
Continue readingHitachi High-Tech launches the GT2000 high-precision electron beam metrology system
Hitachi High-Tech Corporation, Japan, launched the GT2000 high-precision electron beam metrology system to meet the needs of semiconductor device development and mass production in the high-NA EUV generation.
Continue readingNew candidate for universal memory is fast, low-power, stable and long-lasting
Researchers at Stanford University have demonstrated that a new material may make phase-change memory an improved option for future AI and data-centric systems.
Continue readingNoninvasive technique tracks light through photonic circuits
Researchers at the Technion – Israel Institute of Technology, Israel, have shown how to exploit the natural nonlinearity of silicon to track the propagation of light through a circuit to characterize a chip’s performance.
Continue readingZurich Instruments joins project to entangle error-corrected qubits
Zurich Instruments, Switzerland, joins forces with two leading experimental labs at ETH Zurich and MIT, the quantum computing startup Atlantic Quantum, and leading theorists at Université de Sherbrooke and Forschungszentrum Jülich to participate in the SuperMOOSE project, which aims to entangle two error-corrected qubits and thus lay the foundation for future quantum computers.
Continue readingFlaky compound to prevent computer chips from getting fried
A research team from Skoltech, Russia, has improved the properties of a polymer used in 3D printing by adding boron nitride “flakes” to the photopolymer, doubling the material’s thermal conductivity.
Continue readingAmkor advanced packaging enables the car of the future
Amkor Technology, Inc., Tempe, Ariz., a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to enable the car of the future.
Continue readingThermo Fisher Scientific’s new-generation fully automated (S)TEM metrology solution for high volume semiconductor manufacturing
Thermo Fisher Scientific, Hillsboro, Ore., introduced the Thermo Scientific Metrios 6 Scanning Transmission Electron Microscope ((S)TEM) — a new-generation, fully automated (S)TEM metrology solution to help enhance productivity and deliver data quality assurance for high-volume semiconductor manufacturing.
Continue readingImec first to demonstrate conductor films on 300 mm wafers with lower resistivity than Cu and Ru
Imec, Belgium, a world-leading research and innovation hub in nanoelectronics and digital technologies, provided the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect metallization schemes, marking a milestone towards enabling low-resistive interconnect with line widths below 10nm.
Continue readingWith PowerVia, Intel achieves a chipmaking breakthrough
Intel Corporation, Santa Clara, Calif., devised a process to manufacture, test, and demonstrate positive performance results with its new backside power solution called PowerVia, enabling chipmaking to go two-sided for the first time.
Continue readingStretching metals allows researchers to create materials for quantum, electronic, and spintronic applications
A University of Minnesota-led team has developed a first-of-its-kind, breakthrough method that makes it easier to create high-quality metal oxide thin films out of “stubborn” metals that have historically been difficult to synthesize in an atomically precise manner.
Continue readingNew material offers more durable, sustainable multi-level non-volatile phase change memory
Scientists have achieved a breakthrough in the development of non-volatile phase change memory.
Continue readingCamtek to acquire FormFactor’s FRT metrology business
Camtek Ltd., Israel, together with FormFactor, Inc., Livermore, Calif., entered into an agreement for the acquisition by Camtek of FormFactor, Inc.’s FRT Metrology business for $100 million in cash, subject to customary purchase price adjustments.
Continue readingMA-tek follows big clients as it expands
Materials Analysis Technology Inc., Taiwan, is setting up new laboratories in Kumamoto, Japan, and the US state of Arizona to support its “big clients,” and is eyeing more locations in the future amid the changing IC supply chain landscape.
Continue readingOxford Instruments launched its Innovation Center
Oxford Instruments, England, has brought together the best of its analytical innovations to form the Oxford Instruments Innovation Center, a state-of-the-art facility at its High Wycombe site.
Continue readingScientists 3D print a complex robotic hand with bones, tendons, and ligaments
Scientists have tried to use additive manufacturing—better known as 3D printing—to recreate complex structures from hands to hearts. However, the technology stumbles when integrating multiple materials into one printing process. 3D printing a robotic hand, for example, requires multiple printers—one to make the skeleton, another for soft tissue materials—and the assembly of parts. These multiple steps increase manufacturing time and complexity.
Scientists have long sought to combine different materials into a single 3D printing process. A team from the soft robotics lab at ETH Zurich has found a way.
The team equipped a 3D inkjet printer—which is based on the same technology in normal office printers—with machine vision, allowing it to rapidly adapt to different materials. The approach, called vision-controlled jetting, continuously gathers information about a structure’s shape during printing to fine-tune how it prints the next layer, regardless of the type of material.
In a test, the team 3D printed a synthetic hand in one go. Complete with skeleton, ligaments, and tendons, the hand can grasp different objects when it “feels” pressure at its fingertips.
They also 3D printed a structure like a human heart, complete with chambers, one-way valves, and the ability to pump fluid at a rate roughly 40 percent of an adult human’s heart.
Recreating a structure using conventional methods is tedious and error-prone. Engineers cast a mold to form the desired shape—say, the skeleton of a hand—then combine the initial structure with other materials.
It’s a mind-numbing process requiring careful calibration. Like installing a cabinet door, any errors leave it lopsided. For something as complex as a robot hand, the results can be rather Frankenstein.
Traditional methods also make it difficult to incorporate materials with different properties, and they tend to lack the fine details required in something as complex as a synthetic hand. All these limitations kneecap what a robotic hand—and other functional structures—can do.
Then 3D inkjet printing came along. Common versions of these printers squeeze a liquid resin material through hundreds of thousands of individually controlled nozzles—like an office printer printing a photo at high resolution. Once a layer is printed, a UV light “sets” the resin, turning it from liquid to solid. Then the printer gets to work on the next layer. In this way, the printer builds a 3D object, layer by layer, at the microscopic level.
Although incredibly quick and precise, the technology has its problems. It isn’t great at binding different materials together, for instance. To 3D print a functional robot, engineers must either print parts with multiple printers and then assemble them after, or they can print an initial structure, cast around the part, and add additional types of materials with desired properties.
One main drawback is the thickness of each layer isn’t always the same. Differences in the speed of “ink,” interference between nozzles, and shrinkage during the “setting” process can all cause tiny differences. But these inconsistencies add up with more layers, resulting in malfunctioning objects and printing failure.
Engineers tackle this problem by adding a blade or roller. Like flattening newly laid concrete during roadwork, this step levels each layer before the next one starts. The solution, unfortunately, comes with other headaches. Because the rollers are only compatible with some materials—others gunk up the scraper—they limit the range of materials that can be used.
What if we don’t need this step at all?
The team’s solution is machine vision. Rather than scraping away extra material, scanning each layer as it’s printing helps the system detect and compensate for small mistakes in real-time.
The machine vision system uses four cameras and two lasers to scan the entire printing surface at microscopic resolution.
This process helps the printer self-correct, explained the team. By understanding where there’s too much or too little material, the printer can change the amount of ink deposited in the next layer, essentially filling previous “potholes.” The result is a powerful 3D printing system in which extra material doesn’t need to be scraped off.
This isn’t the first time machine vision has been used in 3D printers. But the new system can scan 660 times faster than older ones, and it can analyze the growing structure’s physical shape in less than a second, wrote Kong. This allows the 3D printer to access a much larger library of materials, including substances that support complex structures during printing but are removed later.
As a test, the team printed a synthetic hand with two types of materials: a rigid, load-bearing material to act as a skeleton and a soft bendable material to make tendons and ligaments. They printed channels throughout the hand to control its movement with air pressure and at the same time integrated a membrane to sense touch—essentially, the fingertips.
They hooked the hand to external electrical components and integrated it into a little walking robot. Thanks to its pressure-sensing fingertips, it could pick up different objects—a pen or an empty plastic water bottle.
The system also printed a human-like heart structure with multiple chambers. When pressurizing the synthetic heart, it pumped fluids like its biological counterpart.
Everything was printed in one go.
For more information: Nature
Samsung to unveil 3D AI chip packaging tech SAINT to rival TSMC
Samsung Electronics Co., South Korea, the world’s largest memory chipmaker, plans to unveil an advanced three-dimensional chip packaging technology to compete with foundry leader Taiwan Semiconductor Manufacturing Company.
Continue reading450-million-year-old organism finds new life in softbotics
Researchers from Carnegie Mellon University’s Department of Mechanical Engineering, along with paleontologists from Spain and Poland, have utilized fossil records to create a soft robotic model of Pleurocystitid. This marine organism, which lived about 450 million years ago, is thought to be among the earliest echinoderms that could move using a muscular stem.
The research seeks to broaden the modern perspective of animal design and movement by introducing a new field of study – Paleobionics – aimed at using Softbotics, robotics with flexible electronics and soft materials, to understand the biomechanical factors that drove evolution using extinct organisms.
“Softbotics is another approach to inform science using soft materials to construct flexible robot limbs and appendages. Many fundamental principles of biology and nature can only fully be explained if we look back at the evolutionary timeline of how animals evolved. We are building robot analogs to study how locomotion has changed,” said Carmel Majidi, lead author and Professor of Mechanical Engineering at Carnegie Mellon University.
With humans’ time on earth representing only 0.007% of the planet’s history, the modern-day animal kingdom that influences the understanding of evolution and inspires today’s mechanical systems is only a fraction of all creatures that have existed through history.
Using fossil evidence to guide their design and a combination of 3D printed elements and polymers to mimic the flexible columnar structure of the moving appendage, the team demonstrated that pleurocystitids were likely able to move over the sea bottom by means of a muscular stem that pushed the animal forward.
Despite the absence of a current-day analog (echinoderms have since evolved to include modern-day starfish and sea urchins), pleurocystitids have been of interest to paleontologists due to their pivotal role in echinoderm evolution.
The team determined that wide sweeping movements were likely the most effective motion and that increasing the length of the stem significantly increased the animals’ speed without forcing it to exert more energy.
“Researchers in the bio-inspired robotics community need to pick and choose important features worth adopting from organisms,” explained Richard Desatnik, PhD candidate and co-first author.
“Essentially, we have to decide on good locomotion strategies to get our robots moving. For example, would a starfish robot really need to use 5 limbs for locomotion or can we find a better strategy?” added Zach Patterson, CMU alumnus and co-first author.
Now that the team has demonstrated that they can use Softbotics to engineer extinct organisms, they hope to explore other animals, like the first organism that could travel from sea to land – something that can’t be studied in the same way using conventional robot hardware.
“Bringing a new life to something that existed nearly 500 million years ago is exciting in and of itself, but what really excites us about this breakthrough is how much we will be able to learn from it,” said Phil LeDuc, co-author, and Professor of Mechanical Engineering at Carnegie Mellon University. “We aren’t just looking at fossils in the ground, we are trying to better understand life through working with amazing paleontologists.”
For more information: Proceedings of the National Academy of Sciences
Image: A pleurocystitid fossil and pleurocystitid robot replica. Credit: Carnegie Mellon University College of Engineering.
UK precision engineering firm ASG AMF Engineering expands with new factory
ASG AMF Engineering, a precision engineering company known for manufacturing components and assemblies for research facilities across Europe, announced a significant investment in an additional factory in Wirral, England.
The company will continue to retain its existing premises for machining, creating additional space for future investment. It has enabled the company to increase the size of its clean assembly facility, chemical cleaning and welding processes.
It has also allowed the firm to invest around £400,000 in automated thermal spraying equipment and expanding its UHV cleaning facility.
The new factory unit represents a major step forward for ASG AMF Engineering, allowing the company to streamline its operations and enhance its service offerings. One of the key highlights of this expansion is the additional space created and the ability for further investment in the latest technology.
A £500,000 investment in an additional large 5-axis machining center with pallet loader will enable fully automated lights out machining. This investment will significantly improve the company’s capabilities and increase production capacity.
ASG AMF Engineering’s new thermal spray and cleaning facility has led to increased efficiency and productivity. By automating these processes, the company has freed up skilled labor, ensuring a smoother workflow and maintaining the highest quality standards in the industry. The new factory unit will also facilitate the creation of new jobs, contributing to the local economy and offering employment opportunities within the Wirral community.
ASG AMF Engineering is well-known for its commitment to quality and precision in manufacture of complex components and assemblies. The company’s primary customer base includes prominent names in the semiconductor industry and analytical science, such as ESRF, ILL, CERN. With this expansion, ASG AMF Engineering is poised to better serve its existing clients and cater to the growing demands of these industries.
For more information:
ASG Group
ELES and proteanTecs partner to enhance reliability testing with deep data analytics
ProteanTecs, Israel, a global leader of deep data analytics for advanced electronics, and ELES, Italy, a worldwide provider of semiconductor device reliability testing solutions, announced their partnership for safety and mission-critical applications.
Continue readingAdvantest rolls out thermal control products for MPT3000 solid-state drive test platform
Advantest Corporation, Japan, announced two new additions to its MPT3000 solid-state drive test platform.
Continue readingNew material shows promise for next-generation memory technology
Researchers from Tohoku University, Japan, used sputtering to fabricate large-area 2D vdW tetra-chalcogenides and identified an exceptionally promising material ー niobium telluride ーthat exhibits an ultra-low melting point, opening up new possibilities for developing high-performance phase change memories.
Continue readingAddressing the nation’s need for strong domestic semiconductor industry and infrastructure
Last year, UC Riverside scientists and colleagues at UC Irvine received $5 million from the U.S. Department of Energy, to team up with Sandia National Laboratory in building a diverse educational pipeline in the field of microelectronics. Developing expertise and infrastructure in this field is a priority for industry and government.
Continue readingUSI develops advanced failure analysis technology to meet high-level demands of SiP miniaturization products
Universal Scientific Industrial (Shanghai) Co., Ltd., China, developed an advanced electronic component failure analysis technology to meet the increasingly complex and diverse needs of system-in-package miniaturized products.
Continue readingGeorgia Tech and GlobalFoundries to collaborate on joint semiconductor research and workforce development
Georgia Institute of Technology, Atlanta, one of the top public research universities in the U.S., and GlobalFoundries, Malta, NY., one of the world’s leading semiconductor manufacturers, announced a new partnership to expand collaboration on semiconductor research, education, talent, and workforce development.
Continue readingA step forward in the quest to replace silicon with 2D chips
Researchers at The University of Texas at Austin have discovered more than a dozen different materials for 2D semiconductors that could allow electrons to quickly move around, opening the door for a leap in electronics’ capabilities.
Continue readingQMD precision components business now part of Cirtec Medical
Cirtec Medical Corp., Lowell, Mass., has acquired QMD Precision Components, a business that specializes in the development and manufacturing of silicone, polyisoprene, and other custom elastomeric components, tubing, and subassemblies.
Cirtec is a strategic outsourcing partner of complex medical devices, including minimally invasive and active implantable devices. The acquisition will enable Cirtec to provide customers with advanced expertise in medical silicone molding and extrusion. The integration of Precision Components within the Cirtec brand will offer comprehensive, integrated solutions based on decades of silicone experience. The acquisition will also strengthen Cirtec’s platform for growth in existing markets such as active implantables, interventional, and minimally invasive surgical devices. Precision Components consists of Centers of Excellence in Sturtevant, Wisconsin, and Rock Hill, South Carolina, and engineering and manufacturing capabilities will remain at the facilities, along with current leadership.
FormFactor opens Silicon Valley Demo Center
FormFactor, Inc., Livermore, Calif., a leading semiconductor test and measurement supplier, opened a new product demonstration and training center in San Jose, California. The facility is staffed with applications engineers and training professionals, and features
FormFactor engineering wafer probers, metrology systems and advanced probe cards outfitted to meet semiconductor test and measurement requirements from lab to fab, including solutions for advanced packaging, automotive high-power devices, high-speed digital, silicon photonics, and 5G/6G/millimeter-wave mobile devices.
“The opening of our new demonstration center provides easy access for our customers to see first-hand the benefits of our sophisticated wafer probe and metrology solutions,” said Amy Leong, senior vice president and chief commercial officer. “We are deeply committed to enabling industry innovation, and proud to offer this center to accelerate our customers’ success with personalized, hands-on training, product demonstration, and support.”
FormFactor’s new demonstration center is located in the heart of Silicon Valley and offers a product demonstration lab and clean room, presentation and training areas, service warehouse, office space and conference rooms. The new location complements the capabilities of FormFactor’s existing global demonstration centers in Europe and Asia, and recently opened Advanced Quantum Cryogenic Lab in Boulder, Colorado.
For more information:
FormFactor, Inc.

























Synopsys, Inc., Mountain View, Calif., reaches scale for AI-driven chip designs as major semiconductor customers register the first 100 commercial tape-outs with the company’s award-winning Synopsys DSO.ai autonomous design system. Recent customers, including STMicroelectronics and SK hynix, have all seen significant uplifts in productivity and PPA, and are now charting a new design course using reinforcement learning-enabled design tools on cloud and on-premise.
Veeco Instruments Inc., Plainview, NY, acquired Epiluvac AB, Sweden, a privately held manufacturer of chemical vapor deposition (CVD) epitaxy systems that enable advanced silicon carbide (SiC) applications in the electric vehicle market. Epiluvac’s technology platform combined with Veeco’s global go-to-market capabilities create a significant long-term growth driver for Veeco.