Suss MicroTec, Germany, introduces the XB8 semi-automated wafer bonding platform, which supports substrates with a wafer size of up to 200 mm.
Continue readingSuss MicroTec launches semi-automated high-force wafer bonder
Macom announces milestone in the commercialization of GaN on silicon technology
Macom Technology Solutions Inc., Lowell, Mass., reports that it has shipped more than one million GaN-on-Silicon (GaN on Si) RF power devices to date for communications, military, and other RF applications.
Continue readingJEOL introduces entry level Field Emission SEM with ultrahigh spatial resolution
Jeol USA, Peabody, Mass., introduces the new JSM-7200F FE SEM with ultrahigh spatial resolution of 1.6 nm at 1.0 kV, and high probe current of 300 nA.
Continue readingGlobal Foundries launches 22FDX semiconductor technology for ultralow-power devices
Global Foundries, Santa Clara, Calif., has launched a new semiconductor technology developed specifically to meet the ultralow-power requirements of the next generation of connected devices.
Continue readingBruker XFlash FlatQuad SDD enables high vacuum and low beam-current EDS analysis
Bruker Nano Analytics, Madison, Wis., has developed XFlash FlatQuad, a side-entry silicon drift detector positioned between the SEM pole piece and sample.
Continue readingZeiss hardware/software package streamlines image acquisition and extends capacity of SEMs
Zeiss, Pleasanton, Calif., introduces the Zeiss Atlas 5, a powerful hardware and software package that extends the capacity of its scanning electron microscopes (SEM) and focused ion beam SEMs (FIB-SEM).
Continue readingAustria’s AMS to invest $2 billion in new fab in New York state
AMS AG, Austria, formerly Austriamicrosystem, plans to locate a new 360,000 sq. ft. fab in upstate New York at the Nano Utica site in Marcy to manufacture analog devices on 200/300 mm wafers.
Continue readingDOD awards $75 million to FlexTech Alliance for flexible hybrid electronics
FlexTech Alliance, San Jose, Calif., announces that the U.S. Department of Defense has awarded it $75 million over five years in a Cooperative Agreement to establish and manage a Manufacturing Innovation Institute (MII) for Flexible Hybrid Electronics (FHE MII).
Continue readingCarl Zeiss Microscopy celebrates fifty years of scanning electron microscopes
Carl Zeiss Microscopy Ltd., England, marked the 50th anniversary of the first sale of a commercial scanning electron microscope with an event in Cambridge.
Continue readingRice and Penn State open center for development of 2-D coatings
Rice University, Houston, and Pennsylvania State University, University Park, announce that scientists at a new research center will study, in collaboration with industry, the development of atom-thin two-dimensional coatings.
Continue readingProgressive Surface installs suspension plasma spray systems for semiconductor coatings
Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems for the semiconductor industry.
Continue readingDOD awards $75 million to FlexTech Alliance for flexible hybrid electronics manufacturing
FlexTech Alliance, San Jose, Calif., announces that the U.S. Department of Defense has awarded it $75 million over five years in a Cooperative Agreement to establish and manage a Manufacturing Innovation Institute for Flexible Hybrid Electronics.
Continue readingUtitec expands heat treating capabilities with Ipsen Titan furnace
Ipsen, Cherry Valley, Ill., announces that it recently shipped a Titan vacuum furnace to Utitec’s facility in Watertown, Conn.
Continue readingImec expands R&D of GaN-on-silicon technology for power devices to speed industrialization
Imec Nano-Electronics Research Center, Belgium, is extending its gallium nitride-on-silicon (GaN-on-Si) R&D program.
Continue readingAmkor to invest $60 million in China to expand assembly and test facility
Amkor Technology Inc., Tempe, Ariz., announces plans to invest $60 million to expand its state-of-the-art assembly and test factory located in China’s Shanghai Waigaoqiao Free Trade Zone.
Continue readingHybrid instrument combines photonic-nanomechanical force microscopy and nanospectroscopy
A microscope being developed at the Department of Energy’s Oak Ridge National Laboratory in Tennessee will allow scientists studying biological and synthetic materials to simultaneously observe chemical and physical properties on and beneath the surface.
Continue readingOxford Instruments launches silicon drift detector with ultrahigh resolution at low kV
Oxford Instruments, U.K., has launched X-Max Extreme, a silicon drift detector for ultrahigh resolution FEG and FIB-SEM applications.
Continue readingUniversity of Arkansas to develop circuit simulation model for GaN devices
Researchers at the University of Arkansas, Fayetteville, have received a $200,000 grant to study the modeling of gallium nitride devices.
Continue readingApplied Materials introduces high-performance ALD technology for 3D thin film devices
Applied Materials Inc., Santa Clara, introduces the Applied Olympia ALD (atomic layer deposition) system featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.
Continue readingMaterion doubles capacity for ToughMet CuNiSn alloys
Materion Performance Alloys, Mayfield Heights, Ohio, has more than doubled its capacity to produce foil gauge ToughMet alloys that are used to make the company’s BrushForm 158 copper-nickel-tin alloy strip product line.
Continue readingBlack phosphorus may replace silicon in future devices
Researchers at the Center for Integrated Nanostructure Physics at Sungkyunkwan University, South Korea, report that they have developed a high-performance transistor made of black phosphorus (BP).
Continue readingChinese company to bid for Micron Technology
China’s state-owned Tsinghua Unigroup Ltd. is preparing a $23 billion bid for chipmaker Micron Technology, San Diego, in what some say would be the biggest Chinese takeover of a U.S. company.
Continue readingRohm acquires Powervation for its Intelligent Digital Power platform
Rohm Co. Ltd., Japan, announces that it has completed the acquisition of Powervation Ltd., Cork, Ireland.
Continue reading3D white graphene could keep electronics cool
3D structures of boron nitride might be the right stuff to keep small electronics cool.
Continue readingJeol FE SEM features super hybrid lens design for high resolution imaging
Jeol USA, Peabody, Mass., introduces the 7000 series of Field Emission Scanning Electron Microscopes with ultrahigh resolution and low-kV/low-vacuum operation for imaging and nano-analysis of structures, surface details, and magnetic samples.
Continue readingCadence and Applied Materials collaborate to optimize planarization process
Cadence Design Systems Inc., San Jose, Calif., and Applied Materials Inc., Santa Clara, Calif., are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nm and below.
Continue readingOxford Instruments launches EBSD detector with speed of 1580 points per second
Oxford Instruments, U.K., has launched NordlysMax3, an EBSD detector that acquires indexes and displays results at 1580 points per second.
Continue readingNational Instruments Semiconductor Test Systems feature PXI modular instrumentation
National Instruments, Austin, Texas, introduces its Semiconductor Test Systems (STS), which feature PXI modular instrumentation and open system design software for semiconductor test environments.
Continue readingCould black phosphorus be the next silicon?
New material could make it possible to pack more transistors on a chip, research suggests.
Continue readingMicro-reactor produces silver nanoparticles at room temperature for printed circuits
Engineers at Oregon State University, Corvallis, report that they have invented a way to fabricate silver nanoparticles that are produced at room temperature for printed electronics.
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