Electronics Archives - Page 32 of 39

SPP Technologies to acquire Orbotech’s SPTS Technologies Thermal Products business

Orbotech Ltd., Israel, announces that SPTS Technologies Group (SPTS), U.K., an Orbotech company and supplier of advanced wafer processing solutions, has sold its Thermal Products business to SPP Technologies Co. (SPT), a subsidiary of Sumitomo Precision Products Co.

Nordson March plasma treatment systems designed for packaging applications

Nordson March, Concord, Calif., announces its new Sphere Series plasma treatment systems for wafer-level and 3D packaging applications.

Dense yttrium oxide coats electronic devices via suspension plasma spray

Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems in a semiconductor manufacturing facility.

Picosun ALD technology enables uniform gold films on silicon wafers

Picosun Oy, Finland, and Carleton University, Ottawa, have collaborated to develop a process in which atomic layer deposition (ALD) technology deposits thin uniform gold films on complete silicon wafers.

Ultra 76 Plus tantalum alloy resists corrosion in hot concentrated acids

H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.

Ultra 76 Plus tantalum alloy resists corrosion in hot concentrated acids

H.C. Starck, Newton, Mass., introduces the Ultra 76 Plus tantalum alloy, which is designed to combat aggressive hazardous-chemical corrosion in hot concentrated acids.

Plansee’s new cold rolling mill produces thin moly sheets up to 1000 mm wide

Plansee, Austria, recently invested in an ultramodern cold rolling mill to produce thin and medium-thickness molybdenum sheets up to 1000 mm wide, and to ensure increased capacity.

Suspension plasma spray coats electronic devices with dense yttrium oxide

Progressive Surface, Grand Rapids, Mich., recently installed three 100HE plasma spray systems at a semiconductor industry facility.

SEMI reports fabs are expected to grow spending

SEMI, San Jose, Calif., has published its May update to the World Fab Forecast, reporting on more than 200 facilities with equipment spending in 2015, and more than 175 facilities projected to spend in 2016.

New process enables quick separation of neodymium and dysprosium

Researchers at the University of Pennsylvania, Philadelphia, have reportedly developed a process that could enable the efficient recycling of two rare earth metals, neodymium and dysprosium.

Calibre PERC platform chosen for reliability verification by Intel Custom Foundry

Mentor Graphics Corp., Wilsonville, Ore., announces that Intel Custom Foundry is expanding its 14nm platform offering to include reliability verification based on the Calibre PERC platform for its customers.

New hybrid techniques for backside thinning and polishing improve device uniformity

Ultra Tec Manufacturing, Santa Ana, Calif., has developed new hybrid 3D backside thinning and polishing techniques for the achievement of extremely uniform remaining silicon thickness.

Bruker microscope integrates imaging with 3D optical metrology

Bruker Corp., Billerica, Mass., has released its new Contour Elite 3D Optical Microscopes, which for the first time fully integrate high-definition microscopy imaging with industry-leading three-dimensional optical metrology functionality.

DualBeam PFIB enables failure analysis on semiconductors smaller than 20 nm

FEI, Hillsboro, Ore., introduces the DualBeam plasma-focused ion beam (PFIB) for sample preparation, electrical fault isolation, and electrical failure analysis on sub-20nm semiconductor devices.

DCG Systems acquires MultiProbe for its atomic force probe technology

DCG Systems, Fremont, Calif., has acquired the assets of MultiProbe, the leading provider of atomic force-based nanoprobe solutions for the semiconductor industry.

Graphene coated copper wire could boost chip speeds by up to 30%

Researchers from Stanford University, Stanford, Calif., report that they have developed graphene sheathing material for the copper wires in computer chips.

Transparent stretchable conductors based on nano-accordion structure

Researchers from North Carolina State University, Raleigh, report that they have fabricated stretchable transparent conductors that work because of their “nano-accordion” design.

Flexible polymer electrodes printed with improved electrical properties

The Technical University of Munich (TUM) announces that its researchers have printed razor-thin polymer electrodes with improved electrical properties.

New quantum effect could lead to novel nanoelectronics

A quantum mechanical transport phenomenon demonstrated for the first time in synthetic, atomically-thin layered material at room temperature could lead to novel nanoelectronic circuits and devices, according to researchers at Pennsylvania State University, College Park.

New computer chips made with futuristic materials

Researchers developed a technique for integrating “III-V” materials onto silicon wafers, a breakthrough that may allow an extension to Moore’s Law

Helios NanoLab combines high-resolution SEM and FIB with precision deposition

FEI Co., Hillsboro, Ore., offers the Helios NanoLab 460F1, which combines the highest resolution scanning electron microscope (Elstar+UC SEM) and focused ion beam (Tomahawk FIB) columns on the market today with the most advanced sample manipulation capabilities.