Goodfellow, England, offers a microporous copper foam with pore sizes between 300 and 600 µm and a relative density of around 37%.
Continue readingMicroporous copper foam with relative density of 37% is effective heat sink
Bruker partners with Manchester University for graphene R&D
Bruker Corp., Billerica, Mass., has formed an official partnership with the University of Manchester’s National Graphene Institute (NGI).
Continue readingEdax launches new XRF analyzers for coating thickness and composition analysis
Edax Inc., Mahwah, N.J., has launched the XLNCE SMX-BEN, the first in a series of new XRF analyzers for rapid, nondestructive coating thickness and composition analysis.
Continue readingTSMC certifies Mentor Graphics tools for TSMC 10nm FinFET Technology
Mentor Graphics Corp., Wilsonville, Ore., announces that TSMC and Mentor Graphics have reached the first milestone of their collaboration on 10nm EDA certification.
Continue readingMulti-sensor microscope optical head enables multiple FA techniques
Quantum Focus Instrument Corp., Vista, Calif., introduces QuantumScope, a multi-sensor microscope optical head in which mid-wavelength infrared hot-spot detection, photoemission, and laser signal injection microscopy techniques are integrated into the same optical inspection platform.
Continue readingEutectic gallium-indium nanoparticles developed for inkjet printing of electronic circuits
Purdue University, West Lafayette, Ind., reports that researchers have developed eutectic gallium-indium nanoparticles coated with Ga2O3 or thiol and suspended in ethanol for inkjet printing of electronic circuits.
Continue readingFlir Systems launches three science-grade cooled thermal cameras
Flir Systems, Freeport, Pa., has launched three science-grade thermal cameras: the A6200sc NIR, A8300sc HD MWIR, and A6700sc LWIR.
Continue readingFlir Systems launches three science-grade cooled thermal cameras
Flir Systems, Freeport, Pa., has launched three science-grade thermal cameras: the A6200sc NIR, A8300sc HD MWIR, and A6700sc LWIR. Designed for applications such as electronics development, these cooled cameras deliver high image quality, standardized interfaces, and Matlab integration. The image shows a photo of a cooled InSb pcb from the A6700sc.
Continue readingSandia, Purdue University establish strategic alliance to speed adoption of technology
Sandia National Laboratories, Albuquerque, N.M., and Purdue University, West Lafayette, Ind., have signed an extensive, five-year memorandum of understanding (MOU) to establish a strategic alliance that seeks to solve large national problems, sustain and engage human capital, and accelerate adoption of technology.
Continue readingFifty years of Moore’s Law results in 1.3 transistors on a single integrated circuit
Semi, San Jose, Calif., reports that April 2015 marks the 50th anniversary of Moore’s Law.
Continue readingDuke researchers develop probes for bond testing of 3D integrated circuits
Duke University, Durham, N.C., announces that its researchers have introduced probing solutions that may enable pre-bond and post-bond testing of through-silicon vias and logic dies used in manufacturing semiconductor components.
Continue readingThin porous copper sheets transfer five times more heat from electronic devices
Fujitsu Laboratories, Japan, has reportedly developed the world’s first thin heat pipe designed for small electronic devices.
Continue readingThin cooling device developed for compact electronics
Fujitsu Laboratories Ltd., Japan, developed what is said to be the world’s first thin cooling device designed for small, thin electronic devices.
Continue readingArtificial hand functions by muscles made of bundles of nickel-titanium wire
Engineers at Saarland University have developed an artificial hand with muscles made from bundles of ultrafine nickel-titanium alloy wires that are able to tense and flex.
Continue readingCypress and Spansion complete $5 billion merger
Cypress Semiconductor Corp., San Jose, Calif., and Spansion Inc., Sunnyvale, Calif., have closed the merger of the two companies in an all-stock, tax-free transaction valued at approximately $5 billion.
Continue readingSEMI forecasts strong fab equipment spending in 2015
SEMI, San Jose, Calif., has updated its SEMI World Fab Forecast outlooks for 2015 and 2016.
Continue readingJeol’s fourth-gen AccuTOF-GCx offers higher resolution, accuracy, and sensitivity
Jeol USA, Peabody, Mass., introduces the AccuTOF-GCx, the fourth generation of Jeol’s successful gas chromatography/time-of-flight mass spectrometer systems.
Continue readingCraic adds circular polarization spectroscopy capabilities to its microspectrophotometers
Craic Technologies, San Dimas, Calif., has added circular polarization spectroscopy capabilities to its microspectrophotometers.
Continue readingBruker M2 Blizzard XRF is designed for NDT of printed circuit boards
Bruker AXS Inc., Madison, Wis., introduces the M2 Blizzard, a small-spot X-ray fluorescence spectrometer specifically designed for the nondestructive analysis of printed circuit boards.
Continue readingLaser-based illumination module offers up to four times tilt alignment accuracy
Ultra Tec Mfg. Inc., Santa Ana, Calif., introduces its Ultracollimator module for the Ultrapol Advance Precision lapping and polishing machine.
Continue readingApplied Materials and Tokyo Electron unveil new company name
Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., announce that the name of their combined company is Eteris (ETERnal Innovation for Society).
Continue readingSystem-on-a-chip design reduces failure rate by a factor of nine
Chalmers University of Technology, Sweden, announces that the European Union’s DeSyRe project has resulted in a system-on-a-chip (SOC) that uses 48% less chip area and has a nine times lower failure rate.
Continue readingOff-axis silicon carbide substrate layering builds better semiconductors
Kansas State University, Manhattan, reports that its researchers have developed a better way to build semiconductors and layer them to minimize potential defects.
Continue readingApplied Materials VeritySEM 5i 3D metrology system enables 6 nm measurement
Applied Materials, Santa Clara, Calif., introduces the new VeritySEM 5i 3D metrology system, which provides imaging innovations in advanced e-beam technology and image processing.
Continue readingThree-year U.S.-Ireland R&D initiative to develop advanced semiconductor materials
Tyndall National institute, Ireland, reports that a three-year U.S.-Ireland collaborative scientific project aims to reduce power consumption and increase battery life in mobile devices.
Continue readingCentorr ships furnaces for production of aluminum nitride substrates
Centorr Vacuum Industries, Nashua, N.H., has shipped orders for two high-temperature sintering furnaces for 2015 delivery to a leading firm in the production of aluminum nitride substrates for the LED market in China.
Continue readingGlobal Foundries and Imec partner for joint research on RF solutions for Internet of Things
Global Foundries, Santa Clara, Calif., announces a partnership with Imec, Belgium, for joint research on future radio architectures and designs for highly integrated mobile devices and IoT applications.
Continue readingIntel reports record full-year unit shipments of PCs, servers, tablets, and phones
Intel Corp., Santa Clara, Calif., reports record full-year unit shipments of PCs, servers, tablets, phones, and the Internet of Things; the company exceeded the tablet goal by shipping 46 million units.
Continue readingCraic UV-visible-NIR microspectrophotometer analyzes samples with high speed and accuracy
Craic Technologies, San Dimas, Calif., introduces the Flex UV-visible-NIR microspectrophotometer, which is designed to be flexible in configuration, capabilities, and pricing.
Continue readingSemiconductor equipment industry posts $1.31 billion in January orders worldwide
Semi, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.31 billion in orders worldwide in January 2015.
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