Oxford Instruments, England, announces that it has signed an agreement with one of the largest semiconductor companies in Europe to supply multiple failure analysis systems.

Materion Performance Alloys, a Materion Corporation business, Mayfield Heights, Ohio, is preparing to meet increased demand for high-strength copper alloy strip products following the recent announcement by Mitsubishi Electric Co. that it will stop production of its copper alloy business effective March 2015.

Ultra Tec, Santa Ana, Calif., reports that its Arc-lite antireflective (AR) coating system coats package, board, and wafer level devices very rapidly, generally in less than one minute.

Researchers at the University of Chicago have reportedly developed compounds of cadmium, lead, and bismuth that can be applied as a liquid or paste to join two semiconductors or semiconductor pieces by heating them to several hundred degrees Celsius.

Optomec, Albuquerque, N.M., has signed an agreement with Ceradrop to be its exclusive representative in France for Aerosol Jet systems used for printing electronics.

Harper International, Buffalo, N.Y., has finalized a contract exceeding $3 million for high-temperature vertical and rotary reactors to support the East China Research Institute of Microelectronics (ECRIM).

Shimadzu, Japan, introduces its new UV-3600 Plus UV-VIS-NIR spectrophotometer, which is equipped with three detectors: a photomultiplier tube for ultraviolet and visible regions, and InGaAs and cooled PbS detectors for the near-infrared region.

Physics World, the magazine of the Institute of Physics, U.K., has selected Magnonic Holographic Memory as one of the “2014 Ten Breakthroughs of the Year.”

Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units.

Applied Materials Inc., Santa Clara, Calif., announces that it collaborated with Samsung Electronics Co. Ltd. and Korea’s PSK Inc. to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Researchers at Purdue University, West Lafayette, Ind., have created the first modern complementary metal-oxide-semiconductor device in which germanium is the semiconductor instead of silicon.

Electro Scientific Industries Inc., Portland, Ore., introduces the CornerStone ICP Series 1 UV laser drilling system designed initially for integrated circuit packaging applications.

Ultra Tec Mfg. Inc., Santa Ana, Calif., announces that an improved machine-vision camera is now shipping with its ASAP-1 IPS units.

Amkor Copper, Chandler, Ariz., has available a copper pillar bump flip chip interconnect, which offers advantages in many designs while meeting current and future ROHS requirements.

CoorsTek Inc., Golden, Colo., has reached a definitive agreement with the Carlyle Group and Unison Capital Group to acquire Covalent Materials Corp., Japan.