SUSS MicroTec, Germany, has launched the DSC300 Gen2 projection scanner, a platform for wafer sizes up to 300 mm based on the projection lithography technology developed by SUSS MicroTec Photonic Systems Inc. (formerly Tamarack Scientific).
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Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that researchers it sponsors at the Massachusetts Institute of Technology have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.
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Researchers at the Japan National Institute for Materials Science, International Center for Materials Nanoarchitectonics, and Shinshu University in Japan report that they have developed high-performance ultrathin capacitors.
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Researchers at the University of California Riverside, and the University of Manchester, U.K., report that that a sandwich made of graphene on both sides of a sheet of copper improves the copper’s ability to dissipate heat by 25%.
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Applied Materials Inc., Santa Clara, Calif., and Tokyo Electron Ltd., report that they have received notice from the Committee on Foreign Investment in the United States (CFIUS) that there are no unresolved national security issues relating to the proposed business combination announced last year.
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Researchers at the Berkeley Lab Molecular Foundry report that they have developed rhenium disulfide, a semiconductor that functions electronically as if it were a 2D monolayer even as a 3D bulk material.
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Researchers at Stanford University, Calif., developed a process to create flexible chips that can tolerate power fluctuations in much the same way as silicon circuitry.
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Kyma Technologies Inc., Raleigh, N.C., announces that it has licensed its aluminum nitride PVD of nanocolumns technology to GT Advanced Technologies, Merrimack, N.J.
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Carbodeon, Helsinki, Finland, has released a new PTFE/NanoDiamond coating with twice the durability and up to 66% less friction than current products.
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Bruker Corp., Billerica, Mass., introduces the Fourier 60, an entirely new permanent-magnet based, benchtop FT-NMR (Fourier Transform Nuclear Magnetic Resonance) spectrometer.
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Indium Corp., Utica, N.Y., has developed BiAgX high-melting-point lead-free solder paste for high-reliability electronics assembly.
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Oxford Instruments, U.K., recently acquired Andor, South Windsor, Conn., a market leading supplier of high performance cameras, microscope systems, and software for the physical science and life science industries.
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Heraeus Precious Metals, West Conshohocken, Pa., introduces a thick print copper paste system for power electronic applications where excellent reliability, thermal conductivity, and robust thermal cycling performance are required.
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SUSS MicroTec, Germany, announces the extension of a joint development agreement with the IBM Corporation to further develop, enhance, and propel the application of excimer laser technologies in the realm of advanced semiconductor packaging, including 3D systems integration.
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SEMI, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.38 billion in orders worldwide in December 2013 (three-month average basis) and a book-to-bill ratio of 1.02.
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Brewer Science, Rolla, Mo., introduces CNTRENE 4010, the first aqueous, surfactant-free, ready-to-use semiconducting carbon nanotube inks for microelectronics and printed electronics applications.
Continue readingMentor Graphics Corp., Wilsonville, Ore., announces that the Shanghai ZhangJiang Institute has adopted the Veloce 2 emulation system for its research and development activities targeting the functional verification of System-on-Chip (SoC) integrated circuit designs.
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Asylum Research, Santa Barbara, Calif., an Oxford Instruments company, has developed Scanning Microwave Impedance Microscopy (sMIM).
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Cadence Design Systems Inc., San Jose, Calif., introduces a faster version of the Incisive functional verification platform.
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Imec, Belgium, celebrates its 30th anniversary. Founded in 1984 as a non-profit organization, it has enabled notable advancements in global semiconductor chip manufacturing in the three decades since its founding.
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Lasertec U.S.A., San Jose, Calif., introduces the WASAVI Series BGM300. This instrument measures silicon wafer thicknesses and TSV depths prior to back grinding 3D semiconductor devices.
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Bruker Nanosurfaces Division, Billerica, Mass., introduces the Dektak XTL Stylus Profiler, extending its stylus profilometry capabilities to 200 and 300 mm semiconductor wafer fabs and next-generation touch panel manufacturers.
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Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., has launched a new initiative on Trustworthy and Secure Semiconductors and Systems (T3S).
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Craic Technologies, San Dimas, Calif., introduces Craic TimePro kinetic spectroscopy software. It is designed to be used with Craic Technology’s microspectrophotometers and their controlling Lambdafire software.
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Invensas Corp., San Jose, Calif., announces its latest xFD products solutions. The xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds.
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A torsion tester is a machine that twists a material specimen, such as an iron bar, to measure ultimate torque, but also continuous or intermittent torque loading in both directions of rotation.
Continue readingThe history and process of dual acid decapsulation. This includes basic decapsulation techniques and the correct use of electrostatically dissipative tweezers and proper grounding relative to the Elite Etch Cu ESD decpasulation equipment.
Continue readingNearly 400 Gather in Montreal, Quebec, Canada for Oct. 27 Gala Celebration ASM International, Materials Park, Ohio, commemorated its 100th anniversary with a celebratory gala on Oct. 27 in Montreal, Canada. Nearly 400 guests, including ASM members, past-presidents, dignitaries and valued partners from around the world, came together to celebrate the society’s impact on material science and look ahead to the next century.
Continue readingKennametal Inc., Latrobe, Pa., has signed a definitive agreement to acquire the Tungsten Materials business of Allegheny Technologies Inc., Pittsburgh, for $605 million. With approximately $340 million in annual sales, the business is a leading producer of tungsten metallurgical powders, as well as tooling technologies and components. It consists of two market-leading divisions: ATI Firth Sterling and ATI Stellram.
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Leica Microsystems, Switzerland, has launched two cameras that are ideal instruments for routine brightfield (Leica DMC2900) or fluorescence (Leica DFC3000 G) applications. Both are equipped with sensors that allow live images of up to 30 frames per second and a USB 3.0 interface for fast data transfer. The Leica Application Suite and the fluorescence counterpart Advanced Fluorescence software platform provide for image acquisition and support users in analysis and documentation.
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