Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the new MFP-3D Infinity Atomic Force Microscope, which enables images such as the silicon nitride shown.

SUSS MicroTec, Germany, has successfully qualified its new DSC300 Gen2 projection lithography system for volume production at a major Asian packaging house.

Semiconductor Research Corp., Research Triangle Park, N.C., reports that a team of researchers from Purdue University, Lafayette, Ind.; SEMATECH, Albany, N.Y.; and SUNY College of Nanoscale Science and Engineering, Albany, N.Y., are working on high-performance molybdenum disulfide field-effect transistors.

Entegris Inc., Billerica, Mass., has inaugurated its new i2M Center for Advanced Materials Science in Bedford, Mass.

Engineering researchers at the University of Arkansas, Fayetteville, have designed integrated circuits on silicon–carbide wafers that can survive at temperatures greater than 660°F (350°C).

Lasertec Corp., San Jose, Calif., introduces MAGICS series M8350/M8351, a new line of mask blank inspection systems that meet the requirement of next-generation semiconductor photomasks at the technology nodes of 14nm through 7nm.

Researchers from the University of California, Santa Barbara (UCSB), report that they have developed the highest-performing III-V metal-oxide semiconductor (MOS) field-effect transistors.

Semiconductor Equipment Manufacturing Industries (SEMI), San Jose, Calif., reports that after two years of decline, fab equipment spending for Front End facilities in 2014 is expected to increase by 24% in 2014 (US$35.7 billion).

Peregrine Semiconductor Corp., San Diego, has shipped the first RF switches built on the UltraCMOS 10 technology platform.

Indium Corp., Utica, N.Y., has developed SACm, a high-reliability solder paste that increases the drop-shock performance in portable electronics by 800%, without compromising on thermal cycling.

Applied Materials Inc., has developed its Applied Endura Volta CVD Cobalt system, the only tool capable of encapsulating copper interconnects in logic chips beyond the 28nm node by depositing precise, thin cobalt films.

Suss MicroTec, Germany, recently introduced a coater/developer tool especially developed to process wafers for fan-out wafer-level packaging applications.

Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.

Global Foundries, Austin, Texas, and Samsung, Japan, announce a joint program for fabless companies to skip the 20nm node and move straight to 14nm FinFETs.

The Advanced Circuit Materials Division of Rogers Corp., Rogers, Conn., launches Coolspan thermally and electrically conductive adhesive (TECA) film.

Altera Corp., San Jose, Calif., and Intel Corp., Santa Barbara, Calif., announce their collaboration on the development of multi-die devices that leverage Intel’s world-class package and assembly capabilities and Altera’s leading-edge programmable logic technology.

Researchers at Rice University in Houston and Nanyang Technological University in Singapore have developed a potentially scalable CVD method for making one-atom-thick layers of molybdenum diselenide.

Bruker Corp., Santa Barbara, Calif., presents an online coating analyzer, the S2 Kodiak, which is based on X-ray fluorescence spectrometry.