Bruker Nano Surfaces, Santa Barbara, Calif., announces that it has significantly enhanced the capabilities of its MultiMode platform with the MultiMode 8-HR.

Imec, Belgium, and Coventor, Cary, N.C., announce the expansion of a joint development project to explore process variation issues in 7 nm semiconductor technology.

Goodfellow Corp., Coraopolis, Pa., reports that its microporous copper foam coated with a thin, hard layer of copper oxide provides outstanding performance as a low-profile heat sink in passive cooling environments.

FEI Co., Hillsboro, Ore., introduces the Helios G4 HX as the industry’s highest throughput, dedicated TEM lamella preparation platform, designed to meet the challenges of advanced semiconductor failure analysis labs.

Carbodeon, Finland, has been granted a U.S. patent for detonation-synthesized diamond particles (nanodiamonds) that are combined with polymers to produce wear-resistant materials with good thermal conductivity.

Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company’s next-generation 14-nm FinFET process technology.

Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.

Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.

Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.

Scientists at Penn State University, University Park, have reportedly discovered a way to incorporate vanadium dioxide thin films into transistors and memory devices to improve energy efficiency and robustness.

Bruker Corp., Billerica, Mass., announces that it is to acquire the shares of Jordan Valley Semiconductors Ltd. for its innovative in-line X-ray metrology products, which complement Bruker’s leading position in analytical X-ray technologies.

Bruker Nano Analytics, Madison, Wis., has developed XFlash FlatQuad, a side-entry silicon drift detector positioned between the SEM pole piece and sample.

Zeiss, Pleasanton, Calif., introduces the Zeiss Atlas 5, a powerful hardware and software package that extends the capacity of its scanning electron microscopes (SEM) and focused ion beam SEMs (FIB-SEM).

Rice University, Houston, and Pennsylvania State University, University Park, announce that scientists at a new research center will study, in collaboration with industry, the development of atom-thin two-dimensional coatings.