Brewer Science, Rolla., Mo., has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) Award.

Samsung Electronics, Korea, announces that mass production has begun at its new cutting-edge semiconductor fabrication line in Hwaseong, Korea, to produce chips using a process node of 7 nanometers and below.

Engineers from Nikon Metrology Inc. discussed x-ray technologies and techniques that can provide visualization and metrology analysis of semiconductor chips, at the ASM International ISTFA 2019 conference in Portland, Oregon.

Park Systems, Santa Clara, Calif., and Imec, Belgium, have signed the second Joint Development Project (JDP) within four years to increase the development efforts for future generation in-line AFM metrology solutions.

Engineers from Carl Zeiss Microscopy, Germany, presented a discussion of multi-beam scanning electron microscopes as tools for imaging semiconductor layers in less time at the ASM International ISTFA 2019 conference in Portland, Oregon.

Hitachi High-Tech Corporation, Tokyo, has been recognized by Intel as a recipient of a 2019 Preferred Quality Supplier (PQS) award, by which Intel recognizes companies such as Hitachi High-Tech that Intel believes have relentlessly pursued excellence and conducted business with resolute professionalism

Lam Research Corp., Fremont, Calif., announces the launch of a completely transformed plasma etch technology and system solution, designed to provide chipmakers with advanced functionality and extendibility required for future innovation.

The Semiconductor Industry Association (SIA), Washington, reports that the White House Office of Science and Technology Policy (OSTP) has announced a new interagency working group focused on advancing semiconductor R&D.

Oxford Instruments, England, introduces the Xplore EDS detector, available with a 30 mm2 sensor area and designed for a wide range of applications.

Samsung Electronics Co. Ltd., South Korea, announces that its South Korean facility has begun its first semiconductor mass production line dedicated to the extreme ultraviolet (EUV) lithography technology and to production of chips using a process node of 7 nanometer (nm) and below.

SEMI, Milpitas, Calif.; and VLSI Research, San Jose, Calif., announce that they will publish Semiconductor Manufacturing Monitor, a report covering the semiconductor manufacturing industry from materials to electronic systems.

Researchers from IBM Research and Hamamatsu Photonics discussed the first prototype of a scanning time-resolved emission (STRE) system at the ASM International ISTFA 2019 conference in Portland, Oregon.

IC Insights, Scottsdale, Ariz., recently released its “Global Wafer Capacity 2020-2024” report that features detailed profiles of the five companies with the greatest fab capacity, and includes a ranking of the 25 largest wafer-capacity leaders in terms of monthly installed capacity.

Researchers from Advanced Micro Devices, Thermo Fisher Scientific, and the Fraunhofer Institute for Microstructure of Materials and Systems IMWS, presented a discussion of “Lock-In Thermography” (LIT) at the ASM International ISTFA 2019 conference in Portland, Oregon.

Researchers at the U.S. Department of Energy’s Argonne National Laboratory, Chicago, have developed a new etching technique that could potentially help make small but complex semiconductors.

Picosun Group, Espoo, Finland, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured by its ALD equipment, which deposited film stacks of conductive TiN and insulating dielectric Al2O3 and HfAlO3 layers into high aspect-ratio (up to 100) trenches etched into silicon.

Witec, Germany, announces that it has won The Analytical Scientist Innovation Award as one of the most inventive scientific products of 2019 for Particle Scout, a software tool that enables researchers to find, classify, quantify, and identify particles with unprecedented speed and ease of use.

Techcet CA LLC, San Diego, predicts that global revenues for semiconductor manufacturing and packaging materials will grow 5.7% year-over-year in 2020 to $49.5B, of which 65% represents semiconductor fab materials.

Researchers from Imec and KU Leuven University, Belgium, reported on and demonstrated a new methodology for the localization of dielectric breakdown sites in through-silicon via structures at the ASM International ISTFA 2019 conference in Portland, Ore.