Electronics Archives - Page 35 of 39

Semiconductor equipment sales to reach nearly $44B in 2015

SEMI, San Jose, Calif., projects that worldwide sales of new semiconductor manufacturing equipment will increase 19.3% to $38.0 billion in 2014, according to its year-end forecast.

Sematech makes progress in EUV-resist outgas testing

Sematech, Albany, N.Y., reports that promising progress has been made in qualifying outgassing specifications for extreme ultraviolet (EUV) lithography.

Mentor Graphics EZ-VIP provides re-usable building blocks to cut testbench assembly time

Mentor Graphics Corp., Wilsonville, Ore., announces the immediate availability of its new Mentor EZ-VIP PCI Express Verification IP (VIP).

Helios PFIB designed for semiconductor failure analysis and process development

FEI Corp., Hillsboro, Ore., offers the Helios PFIB for large area deprocessing to enable electrical fault isolation of advanced process ICs, and advanced failure analysis of 3D packages.

Fourth-generation Intel Core processor enables 50% longer battery life

Intel Corp., Santa Clara, Calif., has introduced the 4th generation Intel Core processor family, with power levels as low as 6 watts, up to 50% improvement in battery life over the previous generation in active workloads, and two to three times improvement in standby battery life.

Cadence system SoC verifier enables up to ten times improvement in productivity

Cadence Design Systems Inc., San Jose, Calif., has developed the Cadence Perspec System Verifier platform, a software-driven system-on-chip (SoC) verification solution.

GlobalFoundries and Invecas partner for design service centers

Global Foundries, Santa Clara, Calif., announces a partnership with Invecas Inc., also of Santa Clara, a newly formed design services provider focused on accelerating customer introduction of new products on leading-edge semiconductor process technologies.

GlobalFoundries and Invecas partner for design service centers

Veeco MOCVD system incorporates single-wafer reactor technology

Veeco Instruments Inc., Plainview, N.Y., introduces the Propel Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) system, which incorporates single-wafer reactor technology for outstanding film uniformity, yield, and device performance.

Software enables sub-micron spatial resolution for microspectrophotometers

Craic Technologies, San Dimas, Calif., announces Spectral Surface Mapping (S2M) software for its UV-visible-NIR microspectrophotometers.

ESI announces versatile laser micromachining platform

Electro Scientific Industries Inc., Portland, Maine, announces the µFlex Series multi-axis precision laser micromachining platform.

Applied Materials develops advanced patterning solution for memory devices

Applied Materials Inc., Santa Clara, Calif., announces that it has collaborated with Samsung Electronics Co. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

Imec, Coventor partner to advance CMOS process development

Imec, Belgium, has announced a joint development project with Coventor, Cary, N.C., that will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to Imec’s 10- and 7-nm processes.

Qualcomm joins SRC’s Trustworthy and Secure Semiconductors and Systems initiative

Semiconductor Research Corporation (SRC), Research Triangle Park, N.C., announces that Qualcomm Technologies Inc., a wholly owned subsidiary of Qualcomm Inc., has joined SRC’s Trustworthy and Secure Semiconductors and Systems (T3S) program.

Bruker microtomography system images complete internal structure

Bruker microCT, Belgium, introduces the SkyScan 1172, a high-resolution desktop microtomography (micro-CT) system for 3D nondestructive X-ray imaging of an object’s internal microstructure.

Semiconductor sales in September increase by 8% over last year

The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $87 billion during the third quarter of 2014, an increase of 5.7% over the previous quarter and a jump of 8% compared to the third quarter of 2013.

Precious metal additive manufacturing system for jewelry enables lower cost

Cooksongold, England, and EOS GmbH, Sweden, have launched the Precious M 080 Direct Metal Laser Sintering (DMLS) system.

Optomec announces record orders for 3D printers

Optomec, Albuquerque, N.M., announces that its order bookings have more than doubled through the first three quarters of 2014.

Crystal growth furnace can produce 660-lb sapphire boules

ARC Energy, Nashua, N.H., has announced the CHES 500 crystal growth furnace, designed to produce the world’s largest-ever sapphire boules with a mass of 660 lb and diameter of 500 mm.

GlobalFoundries to acquire IBM’s global semiconductor business

IBM, Armonk, N.Y., and GlobalFoundries, Santa Clara, Calif., today announced that they have signed a Definitive Agreement under which GlobalFoundries plans to acquire IBM’s global commercial semiconductor technology business, including intellectual property, world-class technologists and technologies related to IBM Microelectronics, subject to completion of applicable regulatory reviews.

Samsung to invest $14.7 billion in new semiconductor fab

Samsung Electronics, South Korea, announces plans to invest $14.7 billion in a new semiconductor fabrication facility in Pyeongtaek, South Korea to meet growing demand from smartphones, enterprise computing and the emerging “Internet of Things” market.