Intel Corp., Santa Clara, Calif., has announced the availability of its revolutionary high-density modular test (HDMT) platform.
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Veeco IBD upgrade of Nexus lithography system produces no deposition defects greater than 70 nm
Veeco Instruments Inc., Plainview, N.Y., reports that its new Odyssey ion beam deposition (IBD) upgrade for the NEXUS IBD-LDD system has repeatedly produced photomask blanks with zero deposition defects larger than 70 nanometers.
Continue readingGermanium-tin thin films deposited on silicon could build better infrared cameras
Engineering researchers at the University of Arkansas in Fayetteville have developed an infrared detector made of thin films of GeSn semiconductor material deposited on a silicon substrate.
Continue readingFEI opens new technology center in the Czech Republic
FEI Co., Hillsboro, Ore., announces the opening of a new technology center in the industrial estate of Cernovická Terasa, Brno, Czech Republic.
Continue readingFlexible grid and segmented silver fingers cut cost and weight in solar panels
GT Advanced Technologies Inc., Merrimack, N.J., announces that solar modules incorporating its new Merlin metallization and interconnect technology have met the requirements of several important PV industry certification standards.
Continue readingJEOL’s new NMR spectrometers feature compact size, improved performance
JEOL USA, Peabody, Mass., announces the JNM-ECZS series, a new line of next-generation NMR spectrometers that incorporate ultrahigh-accuracy RF circuitry based on the latest digital high-frequency technology.
Continue readingMentor Graphics acquires XS Embedded for automotive system architectures
Mentor Graphics Corp., Wilsonville, Ore., has acquired XS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms.
Continue readingBruker Esprit Dynamics software enables high-resolution simulation of EBSD patterns
Bruker Nano Analytics, Hartford, Conn., has introduced ESPRIT DynamicS, a highly sophisticated and powerful software tool for the most realistic, high-resolution simulation of electron backscatter diffraction (EBSD) patterns.
Continue readingImpact Coatings develops low-cost replacement for gold-plated contacts
Impact Coatings AB, Sweden, has developed Silver MaxPhase, a silver-colored coating that the company says can replace gold plating in electrical contacts for critical contact surfaces.
Continue readingApplied Materials introduces CVD and CMP systems for 3D architectures
Applied Materials Inc., Santa Clara, Calif., announces two new systems that help customers solve critical challenges in manufacturing high-performance, power-efficient 3D devices.
Continue readingIntel announces new microarchitecture and 14-nm manufacturing process
Intel, Santa Clara, Calif., has released details of the Intel Core M processor, the first product to be manufactured using the optimized 14-nm manufacturing process.
Continue readingCameca launches next-generation atom probe microscope
Cameca, Paris, announces the release of the LEAP 5000, its latest-generation atom probe microscope, which offers unparalleled three-dimensional nanoscale surface, bulk, and interfacial materials analysis with atom-by-atom identification and accurate spatial positioning.
Continue readingCelestica opens microelectronics lab to accelerate commercialization
Celestica Inc., Toronto, announces the opening of its new microelectronics laboratory, an 1100-ft2, ISO Class-6 clean room with a controlled environment for temperature, humidity, and airborne particles.
Continue readingCopper sensors are cheap, light, flexible, and highly conductive
Researchers at Monash University, Melbourne, Australia, have developed a cost-effective way of making flexible copper conductors for commercial applications.
Continue readingAsylum Research receives award for AFM blue laser excitation capability
Oxford Instruments Asylum Research, Santa Barbara, Calif., has received the 2014 Microscopy Today Innovation Award for the development of blueDrive Photothermal Excitation.
Continue readingPorous silicon oxide enables high-density computer memory
Rice University, Houston, announces that its breakthrough silicon oxide technology for high-density, next-generation computer memory is one step closer to mass production, thanks to a refinement that will allow manufacturers to fabricate devices at room temperature with conventional production methods.
Continue readingHybrid microscope combines confocal-scanning-laser and full-color-confocal microscopes
Lasertec, Japan, introduces its Optelics Hybrid microscope, which combines a confocal scanning laser microscope with a full color confocal microscope.
Continue readingHybrid microscope combines confocal-scanning-laser and full-color-confocal microscopes
Lasertec, Japan, introduces its Optelics Hybrid microscope, which combines a confocal scanning laser microscope with a full color confocal microscope.
Continue readingOxford Instruments Asylum Research opens AFM demo lab in Mumbai
Oxford Instruments Asylum Research, Santa Barbara, Calif., announces the opening of its first Nanotechnology Lab for Atomic Force Microscopy (AFM) in Mumbai, India.
Continue readingClassOne electroplating tool designed for 100 to 200-mm substrates
ClassOne Technology, Kalispell, Mont., has launched its Solstice line of electroplating tools designed specifically for 100 to 200-mm substrates.
Continue readingSUSS MicroTec launches ELD 300 excimer laser debonder for 3D integration
SÜSS MicroTec, Germany, has launched an excimer laser debonder, the ELD300, for the stress-free debonding of 200 and 300-mm 3D-IC wafers.
Continue readingPower Electronics Manufacturing Consortium to develop silicon carbide electronic devices
New York State and more than 100 companies, led by General Electric, Schenectady, N.Y., will collaborate to launch the New York Power Electronics Manufacturing Consortium at the SUNY College of Nanoscale Science and Engineering in Albany.
Continue readingAFM with automated defect review of bare wafers increases production throughput by 1000%
Park Systems, Santa Clara, Calif., announces Park NX-Wafer, an AFM designed for bare wafer manufacturing that fully automates the automatic defect review process.
Continue readingBruker SPM system incorporates infrared mode for nanoscale mapping
Bruker Nano Surfaces Division, Tucson, Ariz., announces the release of Inspire, the first integrated scanning probe microscopy infrared system for 10-nm spatial resolution in chemical and materials property mapping.
Continue readingChemical Mechanical Planarization Center formed at Albany Nanotech Complex
Sematech, Albany, N.Y., and the SUNY College of Nanoscale Science and Engineering/SUNY Institute of Technology, have formed the Chemical Mechanical Planarization (CMP) Center, based at the Albany Nanotech Complex.
Continue readingNikon wins “Best of West” award for its Immersion Scanner
Nikon Precision, Belmont, Calif., has won the 2014 “Best of West” Award for its NSR-S630D Immersion Scanner.
Continue readingIBM to research graphene wafers to replace silicon
IBM, Armonk, N.Y., plans to invest $3 billion over the next five years in two broad research and early stage development programs.
Continue readingActuator Solutions wins German Innovation Award for shape memory devices
Actuator Solutions GmbH (ASG), Germany, a subsidiary of Alfmeier Präzision and SAES Getters, has won the 2014 German Innovation Award for its development of a wide range of applications for shape memory devices.
Continue readingOrganic thin-film transistors formed through room-temperature printing
The National Institute for Materials Science, Japan, reports that engineers have developed room-temperature-printed electronics, by which electronic devices can be manufactured at room temperature under ambient atmospheric conditions.
Continue readingCadence and Intel collaborate to support 14nm Tri-Gate design platform
Cadence Design Systems Inc., San Jose, Calif., and Intel Corp., Santa Clara, Calif., announce that they are collaborating to support Intel’s 14nm Tri-Gate process technology for customers of Intel Custom Foundry.
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