Purdue University, West Lafayette, Ind., reports that researchers have developed eutectic gallium-indium nanoparticles coated with Ga2O3 or thiol and suspended in ethanol for inkjet printing of electronic circuits.

Bruker AXS Inc., Madison, Wis., introduces the M2 Blizzard, a small-spot X-ray fluorescence spectrometer specifically designed for the nondestructive analysis of printed circuit boards.

Ultra Tec Mfg. Inc., Santa Ana, Calif., introduces its Ultracollimator module for the Ultrapol Advance Precision lapping and polishing machine.

Chalmers University of Technology, Sweden, announces that the European Union’s DeSyRe project has resulted in a system-on-a-chip (SOC) that uses 48% less chip area and has a nine times lower failure rate.

Kansas State University, Manhattan, reports that its researchers have developed a better way to build semiconductors and layer them to minimize potential defects.

Applied Materials, Santa Clara, Calif., introduces the new VeritySEM 5i 3D metrology system, which provides imaging innovations in advanced e-beam technology and image processing.

Intel Corp., Santa Clara, Calif., reports record full-year unit shipments of PCs, servers, tablets, phones, and the Internet of Things; the company exceeded the tablet goal by shipping 46 million units.

Semi, San Jose, Calif., reports that North America-based manufacturers of semiconductor equipment posted $1.31 billion in orders worldwide in January 2015.

Edax Inc., Mahwah, N.J., has launched the Atom Probe Assist, a new tool designed to help users of atom probe tomography systems prepare specimens for faster and more efficient analysis than previously possible.

A research team at Northwestern University’s McCormick School of Engineering, Evanston, Ill., has investigated the behavior of silver nanowires under cyclic loading to advance the understanding of how they might function in flexible electronics.

Researchers from the Department of Materials Science and Engineering, Stanford University, have reportedly collaborated with researchers in China to produce polymer/carbon-nanotube composite fibers with lengths over 50 cm.

Craic Technologies, San Dimas, Calif., has added Raman microspectroscopy to its flagship product, the 20/30 Perfect Vision microspectrophotometer.

JEOL USA, Peabody, Mass., and the University of California’s Irvine Materials Research Institute (IMRI) have entered into a strategic partnership to create a premier electron microscopy and materials science research facility.

Physics World, the magazine of the Institute of Physics, U.K., has selected Magnonic Holographic Memory as one of the “2014 Ten Breakthroughs of the Year.”

Brewer Science Inc., San Jose, Calif., was honored as the recipient of the 2014 SEMI award for North America for his impact on the manufacturing of integrated circuits in the semiconductor industry.

Advanced Semiconductor Engineering Inc., Taiwan, announces that SEMI, the global micro- and nano-electronics industries association, has awarded ASE the 2014 SEMI Award for North America.

Sematech, Albany, N.Y., reports that promising progress has been made in qualifying outgassing specifications for extreme ultraviolet (EUV) lithography.

FEI Corp., Hillsboro, Ore., offers the Helios PFIB for large area deprocessing to enable electrical fault isolation of advanced process ICs, and advanced failure analysis of 3D packages.