Entanglement is one of the strangest phenomena predicted by quantum mechanics, the theory that underlies most of modern physics.
Continue readingBio-friendly physics phenomenon finds potential in semiconductor wafers
WPI team studies how cracks form in aircraft wings and fuselages
Worcester Polytechnic Institute, Mass., announces that a research team will conduct comprehensive testing and characterization studies to understand and monitor how stress and fatigue cause microscopic damage in metal components.
Continue readingLow-pressure carbonitration developed for case hardening
Karlsruhe Institute of Technology (KIT), Germany, reports that its engineers are now working on low-pressure carbonitration, a process for the case hardening of low-alloy steel with methylamine.
Continue readingLindberg/MPH ships aluminum immersion holding furnace to automotive supplier
Lindberg/MPH, Riverside, Mich., announces the shipment of an electric immersion aluminum holding furnace for a leader in the automotive parts industry to maintain aluminum at the required temperature for die casting.
Continue readingASM Historical Landmark Honors Novelis (with video)
On November 19, 2015, Novelis was honored with an ASM Historical Landmark at its facility in Kingston, Ontario.
Continue readingNucor to acquire cold finish bar assets in Ohio and Georgia
Nucor Corp., Charlotte, N.C., will acquire Gerdau Long Steel’s Bright Bar assets located in Orrville, Ohio, and Cartersville, Ga., for an undisclosed amount.
Continue readingEnergy-absorbing materials offer protection to buildings and athletes (with video)
Purdue University is collaborating with General Motors to develop a new type of energy-absorbing material that might be 3D printed and that could have an impact in areas ranging from earthquake engineering to safer football helmets.
Continue readingNew theory points the way to transform atom-thin materials into powerful conductors
In certain nanomaterials, electrons are able to race through custom-built roadways just one atom wide.
Continue readingCan-Eng receives contracts for continuous mesh belt furnace systems
Can-Eng Furnaces Intl. Ltd., Niagara Falls, Ontario, recently received four contracts for the design, manufacture, and commissioning of its 6000 lb/hour continuous mesh belt atmosphere furnace system.
Continue readingISTFA 2015 breaks attendance records
The International Symposium for Testing & Failure Analysis (ISTFA) 2015 took Portland, Ore., by storm last week with record attendance and fun new events.
Continue readingSolar Atmospheres breaks ground to house 48-foot vacuum furnace
Solar Atmospheres of Western Pa., Hermitage, recently held a groundbreaking ceremony for a facility to house its newest addition, a 48-ft long vacuum furnace with a diameter of 6.5 ft. and a load capacity up to 150,000 pounds.
Continue readingMicron donates $25 million to Boise State for materials research
Boise State University, Idaho, announces a $25 million gift from the Micron Foundation that will have a transformational impact on its engineering materials research programs.
Continue readingGlobal Foundries introduces FX-14 application-specific integrated circuit
Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company’s next-generation 14-nm FinFET process technology.
Continue readingAkhan Semiconductor opens global headquarters in Illinois
Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.
Continue readingSuss wafer bonder supports substrates with wafer size up to 200 mm
Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.
Continue readingArm Ltd. joins global research collaboration for continued scaling of semiconductors
Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.
Continue readingJeol SEM features expanded EDS analysis, hi-rez imaging, and ports for multiple detectors
Jeol USA, Peabody, Mass., introduces the JSM-IT100 scanning electron microscope, which features expanded EDS analysis capabilities and ports for multiple detectors.
Continue readingGlobal semiconductor sales increase by 1.5% in third quarter
The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5% compared to the previous quarter.
Continue readingGlobal Foundries introduces FX-14 application-specific integrated circuit
Global Foundries, Santa Clara, Calif., announces the availability of FX-14, an application-specific integrated circuit development built on the company’s next-generation 14-nm FinFET process technology.
Continue readingAkhan Semiconductor opens global headquarters in Illinois
Akhan Semiconductor, Gurnee, Ill., has opened its global headquarters and production facility to develop and manufacture next-generation diamond-based semiconductors.
Continue readingSuss wafer bonder supports substrates with wafer size up to 200 mm
Suss MicroTec, Germany, has launched XB8, a wafer bonder designed to support substrates with a wafer size up to 200 mm.
Continue readingARM joins global research collaboration for continued scaling of semiconductors
Semiconductor Research Corp., Research Triangle Park, N.C., announces that Arm Ltd., San Jose, Calif., has joined its Global Research Collaboration program.
Continue readingGlobal semiconductor sales increase by 1.5% in third quarter
The Semiconductor Industry Association (SIA), Washington, announces that worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5% compared to the previous quarter.
Continue readingFEI acquires DCG for electrical fault characterization and editing equipment
FEI Co., Hillsboro, Ore., has acquired DCG Systems, Fremont, Calif., a leading supplier of electrical fault characterization, localization, and editing equipment for a wide range of semiconductor and electronics manufacturers.
Continue readingSemiconductor testing method efficiently measures uniformity of conductivity
Northwestern University, Evanston, Ill., reports that a new method of semiconductor characterization that is more accurate, efficient, and simple than existing methods has been developed by its researchers.
Continue readingVanadium dioxide thin films added to transistors improve energy efficiency
Scientists at Penn State University, University Park, have reportedly discovered a way to incorporate vanadium dioxide thin films into transistors and memory devices to improve energy efficiency and robustness.
Continue readingUltratech introduces Superfast 4G+ in-line wafer inspection system
Ultratech Inc., San Jose, Calif., introduces the Superfast 4G+ in-line 3D topography wafer inspection system featuring coherent gradient sensing technology that enables a single wafer inspection tool to measure patterned wafers across the entire fab line at the lowest cost.
Continue readingGrowing skin in a lab
Extracellular matrix is the material that gives tissues like skin, cartilage, or tendon their strength and stretch. It’s been hard to make well in the lab, but scientists report new success.
Continue readingWhite House Energy Summit focuses on advancing technology safety and low-cost energy
Speaking at the White House Summit on Nuclear Energy physicist Christina Back of General Atomics highlighted the urgency of developing next-generation fast-gas reactors with new materials to enhance safety and ensure energy security.
Continue readingNew hybrid imaging systems combines mass spectrometry and microscopy
A tool that provides world-class microscopy and spatially resolved chemical analysis shows considerable promise for advancing a number of areas of study, including chemical science, pharmaceutical development, and disease progression.
Continue reading